| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which remarkably reduces mounting area, has high stability, reliability and production yield. SOLUTION: On electrically isolated die pads 3 and 4, rectangular semiconductor elements 1 and 2 having different functions are mounted and sealed by resin as a single package 6. Suspension leads 5a and 5b are provided on the longer sides and the shorter sides of the package 6 for suspending the die pads 3 and 4 in at least three side directions. When a flash memory and an SRAM are respectively mounted as the semiconductor elements 1 and 2, a mounting area of 400 mm<2> is required by conventional two packages in total, while this package requires 223 mm<2> , thereby reducing the mounting area by approximately 44%. |
