| 摘要 |
PROBLEM TO BE SOLVED: To provide a lower reception device of a workpiece that can position the workpiece, for example, of a substrate and a carrier through which warpages can be easily generated to a given workpiece position in a horizontal attitude. SOLUTION: A vacuum pad 44 is arranged at an opening part 43 of a backup member 40. The upper surface of the vacuum pad 44 projects towards an upper part, as compared with the upper surface of the backup member 40. A rod 42 of a cylinder 41 is allowed to project for raising the backup member 40, so that the upper surface of the suction pad 44 is brought into contact with the lower surface of a substrate 1. Then, when a vacuum chuck means 47 is driven for chucking the substrate 1 with vacuum, the vacuum pad 44 allows the substrate 1 to contact the upper surface of the backup member 40, while being deformed flat by own elasticity, and corrects the warpage of the substrate 1. Then bonding is applied to and a chip is mounted at the substrate 1. |
