| 摘要 |
PROBLEM TO BE SOLVED: To reduce a time for vacuuming and to prevent a resist pattern obtained by exposure from damage of the resist pattern, by forming a light shielding pattern and a projecting region of a specific height. SOLUTION: On a surface of a transparent substrate, a light shielding pattern and 1 μm or higher projecting region are formed. The height of the projecting area is desirably 1-30 μm, more desirably, 2-10 μm, further more desirably, 3-8 μm. When the substrate surface is brought into contact with a photo-sensitive layer for photo-resist, a space is produced between a mask surface and a photo- resist photo-sensitive layer surface on a non-projecting region area by providing the light shielding pattern and also the projecting part region on the surface of the substrate, therefore, the air existing inside comes off through the space, and the mask for photo-resist is brought into close and sufficient contact with the photo-sensitive material. And, a resist obtained from an exposed photo-sensitive layer by using this mask for photo-resist will not be deformed. |
