发明名称 INSPECTION METHOD FOR MOUNTING STATE OF ELECTRONIC PARTS
摘要 PROBLEM TO BE SOLVED: To provide a mounting state inspection method capable of easily and surely inspecting mounting state of electronic parts regardless of a mirror finished upper surface of mounted electronic parts on a substrate. SOLUTION: By the irradiation of laser beam from upward to a point of the height to be measured of an electronic parts mounted on a substrate 4, and the reception of the diffused reflection of the laser beam by a position detecting sensor PDS(position detecting sensor) 17, mounting state of the electronic parts 5 is inspected by determining the height of the position to be measured. In case an upper surface of the electronic parts 5 is mirror finished, the laser beam is totally reflected and a receiving intensity of radiation of the PDS 17 is small, so a measured value of the height of the electronic parts mounted on the substrate 4 is lower than the height of the substrate 4. Applying this fact, if a measuring result shows that the height of the electronic parts mounted on a substrate 4 is lower than the height of the substrate 4, it is concluded that the electronic parts with the mirror finished surface exists at the measured point.
申请公布号 JPH1114319(A) 申请公布日期 1999.01.22
申请号 JP19970168254 申请日期 1997.06.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KUSUKI HIRONORI;TSUKAMOTO MITSUHAYA;OKADA KOICHI
分类号 G01B11/24;G01B11/245;G01N21/88;G01N21/956;H05K13/08 主分类号 G01B11/24
代理机构 代理人
主权项
地址