| 摘要 |
PROBLEM TO BE SOLVED: To enhance the volumetric efficiency of an electronic chip device while reducing the size and enhancing the performance. SOLUTION: An electronic device is sealed with a first insulating resin 3b at the parts thereof requiring the resin sealing strength in view point of structure and performance and then sealed with a second insulating resin 4 at the parts requiring no resin sealing strength by a roller coating method or a transfer method. The second insulating resin 4 is a phenol based or an epoxy based resin conditioned to semi-paste state which is applied by 10-100 μm thick. |
