| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device superior in adhesiveness by sealing a copper material having a copper alloy layer containing a specified amount of silicon atoms for the thickness of a specified range on a surface layer with the hardening object of an epoxy resin composition constituted of an epoxy resin, hardener and inorganic filler. SOLUTION: The lead frame 2 is formed of the copper material and the copper alloy layer containing 8-50 atom % of the silicon atoms for the thickness of 10-10000 angstroms on the surface layer of the copper material. A semiconductor element 1 is adhered to the lead frame 2 by the die bonding agent 3 of solder and silver paste and it is wire-bonded to an arbitrary circuit by wire 4. The lead frame is sealed with the hardening object 5 of epoxy resin composition containing epoxy resin, hardener and inorganic filler. Thus, the semiconductor device where adhesiveness with epoxy resin composition is improved can be provided.</p> |
