发明名称 ELECTRONIC COMPONENT AUTOMATIC LOADING SYSTEM
摘要 PROBLEM TO BE SOLVED: To improve the soldering quality of the soldering site of an electronic component. SOLUTION: An electronic component automatic loading system has a device for inspecting the degree of cleanliness of the component, that includes an LED lighting part 2 for lighting an electronic component 7 in a process immediately before loading, a CCD camera 4 for observing the degree of cleanliness of the component 7 due to a reflected light 3 of the component 7 by the lighting of the LED lighting part, an image-processing device 5 for judging the quality of the degree of cleanliness of the component 7 by comparing the luminance level of the solder site of the component 7 from the CCD camera 4 with a reference value set in advance, and a personal computer 6.
申请公布号 JPH1117398(A) 申请公布日期 1999.01.22
申请号 JP19970167371 申请日期 1997.06.24
申请人 SAITAMA NIPPON DENKI KK 发明人 MATSUHASHI KENJI
分类号 B23P21/00;G01N21/88;G01N21/93;G01N21/94;G01N21/956;H05K3/34;H05K13/04;H05K13/08 主分类号 B23P21/00
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