| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board, composed of an insulation base made of an inorg. insulator powder bonded with a thermosetting resin and wiring conductors made of a metal powder bonded with a thermosetting resin and manufacture thereof with has superior moisture resistance and can normally and stably operate the incorporated semiconductor devices for a long time by preventing the water content of the outside air from entering the insulation base between insulation boards. SOLUTION: This wiring board comprises an insulation base 1 composed of insulation boards 1a-1c made of an inorganic powder 60-95 wt.% bonded with a thermosetting resin 5-40 wt.%, wiring conductors 2 which are made of a metallic powder bonded with a thermosetting resin and disposed between the boards 1a-1c, and insulation layer 5 made by depositing a thermosetting resin or inorganic insulator power bonded with a thermosetting resin on the side faces of the base 1. The insulation layer 5 selectively blocks the water content of the outside air from entering so as to normally and stably operate the incorporated semiconductor devices for a long time.</p> |
