| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a multilayer wiring board which may not crack an insulation base against external stresses, may not disconnect other inner wirings due to expansion of cracks or due to peel of through-hole conductors, and may not peel connection pads from the board connected to the through-hole conductors. SOLUTION: At least low-resistance wiring conductors 2 integrated in an insulation base 3, and through-hole conductors 4 connected to these conductors 2 are made of a metallized compsn., mainly contg. Mo. and wiring conductors 5 forming on the surface of the base 3 and through-hole conductors 6 connected to the conductors 5 are made of a metallized compsn. contg. mainly W to form a multilayer wiring board 1.</p> |
