| 摘要 |
PROBLEM TO BE SOLVED: To entire an electromagnetic shield and improve the heat dissipating ability by forming a lead frame with its extension bent to cover a resin mold and boring a window through corresponding portion at the front of a light emitting device. SOLUTION: A lead frame 11 has extensions 11a, 11b outside a mold resin 13 to cover the front and back of the resin 13, respectively. The extension 11a has a window made to emit a light from a light emitting device 16 disposed in the mold resin 13, a drive IC 17 and chip capacitor 18 are mounted on the lead frame 11 in addition to the device 16, the drive IC 17 is disposed at a part integrated with the extensions 11a, 11b of the frame 11 to thereby efficiently radiate much heat produced in the IC 17. |
