| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wire-bonding device, which can reduce the dispersion of the applied directions of supersonic waves against the inner lead parts of a lead frame and chips having semiconductor elements, which can use the former lead frame as it is and which is not enlarged. SOLUTION: This device has a bonding tool which connects chips 31 having has semiconductor elements and inner lead parts 42 of a lead frame 41 by the supersonic waves by using a metallic fine wire, an arm 22 holding the bonding tool 21, a bonding head 23 which can support the arm 22, so that it can freely move forwards and backwards to/from the lead frame 41 and a stage 24, which holds the bonding head 23 and which is freely movable with respect to the lead frame 41. The bonding head 23 supports the arm 22, so that the forward/backward directions of the arm 22 maintain an angle of 45 degrees for the longitudinal directions of all the inner lead parts 42.</p> |
