| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor chip package having nearly the same size as that of a semiconductor chip. SOLUTION: To package a center pad type semiconductor chip 31, an opening 22 is formed at a central part, and the chip 31 is adhered to the lower face. Accordingly, input/output pads 32 of the chip 31, electrically coupled with a circuit wiring on a flexible circuit board top face through the openings 22, and hence the size of the package 60 can be reduced to the same size as that of the chip 31. The chip 31 is electrically coupled with a flexible circuit board through metal wires 33, this board is electrically coupled with an outer circuit board through outer connection terminals 35, the pads 32, bonding pads and wires 33 are sealed with a liq. seal resin 34 having specified viscosity and dams 66 formed at the peripheries of the openings 22 block the resin 34 from overflowing.</p> |
