METHOD FOR PACKAGING HEATER-HEATED OPTICAL WAVEGUIDE AND ITS PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide the packaging method and package for obtaining a high temperature control optical waveguide circuit device which has small power consumption. SOLUTION: In this packaging method, an optical waveguide 4 is floated in the package 1 through columns. The number of the columns is 1 to 4 and the area of a fixation surface for a column 3 is preferably 0.03 to 1 cm<2> . The package 1 may be formed of resin. The package 1 is constituted in double wall structure and preferably has its inter-wall hollow part charged with gas, liquid, or a solid of small heat conductivity or vacuummized. The surface of the package is preferably uneven or curved. The surface of the package may be a metallic mirror surface which reflects infrared light.