| 摘要 |
<p>PROBLEM TO BE SOLVED: To compensate for the drop in crosslinking strength between a semiconductor layer and an insulating layer, even in the case that interface diffusion method is used by providing a polyolefin layer made of polyolefin resin material which is higher in the content of crosslinking agents than the insulating layer, between the semiconductor layer and the insulating layer. SOLUTION: There are provided an inner semiconductor layer 6, an insulating layer 7, and an outer semiconductor layer 8 for connection, on the conductor connection which is coupled by a compressive coupling 5 or the like, the exposed parts at the tips of resin-covered cables where the conductors 1 are covered with inner semiconductor layers 2, insulating layers 3, and outer semiconductor layers 4. Then, this is provided with polyolefin reinforcing layers 9, made of a polyolefin resin material higher in the content of crosslinking agents than the insulating layer between the inner semiconductor layer 6 and the insulating layer 7, and between the insulating layer 7 and the outer semiconductor layer 8. As a result even if interface diffusion method is adopted, the degree of crosslinking in the vicinity of the interface between the semiconductor layer and the insulating layer is improved, so that the insulation performance of the cable connection, etc., can be improved.</p> |
