| 摘要 |
PROBLEM TO BE SOLVED: To prevent influence caused by focus displacement when a circuit pattern is printed on a wafer by exposure. SOLUTION: A metallic pattern 3 being the layout pattern of an IC is stuck on a transparent base plate glass 5, and coated with a transparent cover glass (cover plate) 1. At this time, a space S of >= about 1 mm is provided between the pattern 3 and the glass 1 so that the pattern 3 is not brought into contact with the glass 1; and a peripheral edge aperture part between the glass 5 and the cover plate 1 is hermetically sealed by adhesive 4, such dry gas not including oxygen as nitrogen is injected between the glass 5 and the plate 1, and a dry gas layer 2 is secured between the glass 5 and the plate 1. |
