| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the necessity of bumps for bonding and to simplify the connection structure of a semiconductor chip with package leads by a method wherein the package leads are directly connected by bonding with bonding pads arranged on the main surface of the chip, not through the bumps. SOLUTION: This semiconductor device is a device for connecting electrically a plurality of bonding pads 2 on a semiconductor chip 1 having a semiconductor substrate with the main surface formed with a circuit with package leads 4 arranged on an insulating base material 3. The leads 4 are directly connected by bonding with the pads 2 arranged on the main surface of the chip 1 without the intermediary of bumps, and these bonding-connected regions are covered with an insulating resin 5. By covering the regions in such a way, the chip is sealed without using a transfer molding method. As a result, the production processes of a package of a Lead On Chip(LOC) structure can be reduced and the enhancement of the productivity of the package can be contrived. |
