| 摘要 |
PROBLEM TO BE SOLVED: To realize high-density packaging and reduce the number of assembling steps by stacking circuit modules, each having a liquid-crystal polyester substrate with a surface-packaged component. SOLUTION: A circuit module 1 comprises a cubic substrate 6 having a recess 2 inside, a plurality of terminals 3 provided on the upper peripheral edge and bottom peripheral sides of the recess 2, a wiring pattern 4 connected to the respective terminals 3, and a surface package part 5 packaged in the recess 2. Further, a holding portion 2a is formed on an upper outer end of the cubic substrate 6, and a locking piece 2b to be fitted with a holding portion 2a is formed on the bottom outer end. Meanwhile, different types of circuit modules 1a, 1b,... having differing wiring patterns 4 and/or surface packaging parts 5 are provided. The plurality of circuit modules are stacked on the circuit module 1 as the bottom module. Then the circuit module 1 is mounted on a print wiring board 7, having terminals 7a corresponding to the respective terminals 3 on the bottom surface of the circuit module 1, and a support hole 7b corresponding to the locking piece 2b and is connected to other electronic circuits. |
