TEMPERATURE CONTROL METHOD FOR ELECTRONIC UNIT AND DEVICE FOR THE METHOD

摘要

PROBLEM TO BE SOLVED: To efficiently cool parts at high speed and to miniaturize a whole device by detecting a temperature by means of micro thin film thermocouple which is directly formed on the surface of an electronic unit and directly cooling it. SOLUTION: The thermocouple (micro thin film thermocouple) 2 constituted of micro thin films is provided on the surface of a semiconductor chip 1. The temperature of the real heating part of a lead wire 6 in the semiconductor chip 1 rises and thermoelectromotive force is generated in the micro thin film thermocouple 2. A temperature detection circuit 3 detects the temperature from the magnitude of thermoelectromotive force and the signal of the detection temperature is inputted to a power control circuit 4. The power control circuit 4 operates the value of temperature control voltage in the magnitude necessary for cooling in accordance with a temperature value and the command of voltage application is issued to a power source 5. The power source 5 applies temperature control voltage in a direction opposite to thermoelectromotive force to the micro thin film thermocouple 2 through conductors 9A and 9B with the command. The micro thin film thermocouple 2 cools the real heating part of the lead wire 6 and the like with Peltier effect.