发明名称 Method for making copper foil covered laminates esp. for electrical circuit boards
摘要 Laminates, esp. industrial laminates, are made by covering both sides of a prepreg (1) with metal foil, esp. copper foil. Press plates (3) are covered top and/or bottom (2o,2u) with sections of copper foil cut from an upper and lower continuous foil line. A stack of prepregs (1) and covered press plates (3) is then assembled in a press. When assembling the stack, every second press plate is turned over through 180 deg and the top (3b) and bottom (3a) plates are covered only on the lower (2u) and upper (2o) sides respectively. In this way each prepreg is covered on both sides by foil from only the upper or only from the lower foil line.
申请公布号 DE19731133(A1) 申请公布日期 1999.01.21
申请号 DE19971031133 申请日期 1997.07.19
申请人 G. SIEMPELKAMP GMBH & CO, 47803 KREFELD, DE 发明人
分类号 H05K3/02;(IPC1-7):B32B31/12;B32B15/08;B32B15/20 主分类号 H05K3/02
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