| 摘要 |
<p>Apparatus for measuring the temperature of workpieces, particularly semiconductor wafers (W), during their processing, including a head assembly (10) having a head plate (32) circumscribed by a raised rim (36) for receiving the workpiece (W) and for spacing it from the head plate (32) to define an enclosed volume between the head plate (32), rim (36), and workpiece (W); a thermally-conductive member, e.g. an optical fiber (30), passing through the head assembly (10) and having one end exposed to the enclosed volume such that it receives thermal radiation therefrom; and a thermal detector (80) aligned with the opposite end of the thermally-conductive member (30) for detecting the thermal radiation received by it from the enclosed volume and for converting same to an electrical signal representing a measurement of the temperature of the enclosed volume.</p> |
