发明名称 MODULAR ARCHITECTURE FOR SEMICONDUCTOR WAFER FABRICATION EQUIPMENT
摘要 A modular vacuum system may have vacuum chamber modules, power supply modules and control system modules. The vacuum chamber modules may be defined with a clear interface between them. There may be several interfaces on a transfer chamber module that provide connections to any process chamber module. The interfaces may provide common facilities and electrical connections to matching connections on the process chambers and may also provide some configurability with a removable optional facilities interface. The power supply modules may provide all of the power necessary for one corresponding chamber module and be built into cabinets for connecting together as a modular and scalable system. The modular control system may have objects that represent each chamber module in the vacuum system; and may have a system level that configures, initiates, distributes and controls the objects. Each of the objects may be made of a hierarchical set of software modules that represent the different functions and devices of the chamber modules.
申请公布号 WO9903133(A1) 申请公布日期 1999.01.21
申请号 WO1998US14174 申请日期 1998.07.10
申请人 APPLIED MATERIALS, INC. 发明人 MOORING, BEN;BRIGHT, NICK
分类号 H01L21/302;C23C16/00;H01L21/00;H01L21/205;H01L21/3065;(IPC1-7):H01L21/00 主分类号 H01L21/302
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