| 发明名称 |
Electroplating of low-stress nickel |
| 摘要 |
<p>Nickel and nickel alloys can be electroplated from an aqueous acidic solution containing nickel alkane sulfonic acid and a stress-reducing additive that imparts compressive stress to an electrodeposit. The electroplating bath is acidic with a pH of 0 to 5.</p> |
| 申请公布号 |
EP0892087(A2) |
申请公布日期 |
1999.01.20 |
| 申请号 |
EP19980304642 |
申请日期 |
1998.06.11 |
| 申请人 |
ATOTECH DEUTSCHLAND GMBH |
发明人 |
MARTYAK, NICHOLAS |
| 分类号 |
C25D21/14;C25D3/12;(IPC1-7):C25D3/12 |
主分类号 |
C25D21/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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