| 摘要 |
<p>A cooling module is provided, in combination with an electronic circuit component (7) mounted on a printed circuit board (9). The cooling module includes a heat transfer plate (3), for conducting heat from the electronic circuit component (7), resilient biasing means (5) connected to the heat transfer body (3) and serving to urge that body (3) towards the electronic circuit component (7), and guide means (160, 170) for guiding the heat transfer body (3) towards the electronic circuit component (7). The guide means (160, 170) comprise a plurality of elongate guide members (160, 170), spaced apart laterally around a peripheral region of the heat transfer body (3) and extending longitudinally in the direction from that body (3) towards the electronic circuit component (7), and each of the elongate guide members (160, 170) has a lateral surface portion arranged for guiding engagement with an adjacent lateral surface portion (151) of the heat transfer body (3, 150), one of which lateral surface portions is concave so that it partially surrounds the other. Such guide means can serve to locate the heat transfer body in its desired position in an advantageous manner. <IMAGE></p> |
