| 摘要 |
PURPOSE:To simplify the processing to detect defects and to improve the accuracy of detection by selectively extracting the defect parts by the reversal processing of resist patterns. CONSTITUTION:The resist 1C of exposed parts 30 is made into the resist soluble in alkalis if the resist film 1C formed on a substrate 1 having a metallic film 1b is subjected to a primary exposing by sing a mask 2B to be inspected. A black detect part 22 is unexposed and a white defect part 21 is soluble in alkalis. The exposed parts 30 are converted to the resist soluble in alkalis when such resist film is subjected to the pattern reversal processing. Only the defect parts 21, 22 are made into the blanked patterns if the resist film is developed after the mask pattern 2B is shifted by a repeating pitch (usually one pitch) and the resist film is subjected to the secondary exposing. The substrate 1 with which light transmits only the defect parts 21, 22 is obtd. by the etching of the metallic film 1b. The inspection is thus executed with high accuracy without requiring the intricate processing. |
