Method of forming a buried plate,申请号GB19980025779-传众专利搜索

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发明名称	Method of forming a buried plate
摘要
申请公布号	GB9825779(D0)	申请公布日期	1999.01.20
申请号	GB19980025779	申请日期	1998.11.26
申请人	SIEMENS MICROELECTRONICS LIMITED	发明人
分类号	H01L27/108;H01L21/225;H01L21/28;H01L21/334;H01L21/8242	主分类号	H01L27/108
代理机构		代理人
主权项
地址

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