| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing thin IC cards simply. SOLUTION: An adhesive-coated tape 4 is stuck on the lower surface of a print substrate 1 having predetermined wiring patterns formed on the upper surface and an opening part 3 formed by cutting off a part thereof. An IC chip 5 is inserted in the opening part 3 so that the IC chip 5 is secured tentatively therein. A bonding pad on the IC chip 5 and a bonding pad on the print substrate 1 are connected by a bonding wire 6. After confirming the complete solidification of sealing resin for resin sealing the opening 3 and the peripheral part of the opening 3, the adhesive-coated tape 4 is separated in order to obtain an IC card having a formation denoted in figure (e). |
