| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device provided with a detector which can surely detect a wafer jumping out from a top ring while it is being ground. SOLUTION: A polishing device puts a wafer Wf mounted on a top ring 20 into contact with an abrasive cloth 11 on the top surface of a turntable 10 and polishes the surface to be polished of the wafer Wf by the rotation of the turntable 10 and the top ring 20, and is provided with a wafer sensor 21 for detecting the wafer Wf jumped out from the top ring 20 near the top ring 20 and in the downstream in the direction of rotation of the turntable 10. |
