| 摘要 |
PROBLEM TO BE SOLVED: To produce an aluminum nitride-based sintered material having a thermal expansion coefficient nearly equal to alumina and a heat conductivity exceedingly higher than alumina and suitable as a high heat-irradiating lid material of an alumina IC package at a baking temperature lower than usual without requiring any pressing process. SOLUTION: A molded material of a blend comprising aluminum nitride powder and titanium nitride powder in an amount of 30-50 vol.% of the aluminum nitride powder or nickel powder in an amount of 20-30 vol.% of the aluminum nitride powder and a Y2 O3 -CaO-Al2 O3 -based sintering auxiliary (an auxiliary comprising 42-46 wt.% of Y2 O3 , 45-49 wt.% of CaO and 8-10 wt.% of Al2 O3 ) in an amount of 0.5-2 pts.wt. to total 100 pts.wt. of the aluminum nitride powder and titanium nitride powder or the nickel powder is laid on a non-oxide setter and sintered in a reducing atmosphere at 1,650-1,750 deg.C without pressing to obtained the objective aluminum nitride-based sintered material. |
