发明名称 |
Low RC interconnection |
摘要 |
A low RC delay interconnection pattern is formed with a low resistivity metal, such as copper, and a low dielectric constant material, such as organic polymers. An intermediate bonding layer is formed between the low resistivity metal and low dielectric constant material employing an adhesion promoter, such as a silane-based adhesion promoter. The adhesion promoter can be applied between the metal and dielectric layers or incorporated in the dielectric layer. |
申请公布号 |
US5861677(A) |
申请公布日期 |
1999.01.19 |
申请号 |
US19970890905 |
申请日期 |
1997.07.10 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
YOU, LU;CHEUNG, ROBIN W.;CHAN, SIMON S.;HUANG, RICHARD J. |
分类号 |
H01L21/3205;H01L21/312;H01L21/768;H01L23/31;H01L23/52;H01L23/522;H01L23/532;(IPC1-7):B29B13/00;B05D3/02;H01L21/283 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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