| 摘要 |
A computer vision apparatus (10) and methods for automatically inspecting two-dimensional (2D) and three-dimensional (3D) criteria of objects (16) using a single camera (17) and laser sources (11, 12). A camera (17) views the object (16) under inspection which is illuminated by a first source of light (18) to highlight the region of interest. This provides image data for two-dimensional analysis by a computer (19) coupled to the system. Subsequently, multiple laser sources (11, 12) mounted on a positioner provide the illumination for collecting images for three-dimensional analysis. A computer (19) with a monitor is connected to the camera (17) to perform the inspection and analysis and for operator supervision of the system. Specific implementations provided refer to embodiments for inspecting packaged semiconductor devices such as Ball-Grid Arrays packages (16b), Quad Flat Packages (16a), solder ball, lead defects, chip sized packages, Flip-Chip Bump and I.C. Die inspection. |
