发明名称 |
Substrate for transferring bumps and method of use |
摘要 |
A first pattern of bumps and a second pattern of bumps are formed on a substrate (10) with bumps (14,15). During a transfer process, only the bumps (14) of the first pattern of bumps are transferred to pad extensions (20) of a device (17). The bumps (15) of the second pattern of bumps are not affected by this process and can be later transferred to a second device. |
申请公布号 |
US5860585(A) |
申请公布日期 |
1999.01.19 |
申请号 |
US19960658907 |
申请日期 |
1996.05.31 |
申请人 |
MOTOROLA, INC. |
发明人 |
RUTLEDGE, JAMES L.;KASKOUN, KENNETH;WANG, JAMES JEN-HO |
分类号 |
H01L21/60;H01L23/485;H05K3/34;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|