发明名称 Channel stop implant profile shaping scheme for field isolation
摘要 The present invention is a semiconductor device and a method of providing such a semiconductor device which allows a high junction breakdown voltage and a high field turn on voltage, while allowing the field oxide thickness to be limited and being independent of a misalignment of the mask. A method in accordance with the present invention for providing a semiconductor device including a field oxide, the field oxide including a field oxide boundary wherein the field oxide is located within the boundary, the method comprising the step of implanting a first implant area into the substrate, including areas proximate indistance to a junction area, the first area being implanted with a first implant concentration and implanting a second implant area distal to the junction area, the second implant area being implanted with a second implant concentration, wherein the depth of the implant is controlled by the energy level, wherein the implant of the second implant area is independent of a misalignment of a mask.
申请公布号 US5861338(A) 申请公布日期 1999.01.19
申请号 US19970786815 申请日期 1997.01.21
申请人 ADVANCED MICRO DEVICES, INC. 发明人 HU, CHUNG-YOU
分类号 H01L21/762;(IPC1-7):H01L21/76 主分类号 H01L21/762
代理机构 代理人
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