| 摘要 |
PROBLEM TO BE SOLVED: To obtain a copper and a copper base alloy enabling soldering and excellent in direct bonding property without using flux by regulating surface roughness and oxide film thickness to in specific range. SOLUTION: The surface roughness of the copper and the copper base alloy is regulated to <=0.10μm average roughness (Ra) in the center line and <=1.0μm the max surface roughness (Rmax). By this method, in the joining of a lead and a bonding wire, the stable and intensive joined force can be obtd. The thickness of the oxide film is regulated to <=6 nm. This thickness is thin enough to execute the soldering without using the flux. In the case of exceeding this value, the joined strength and the soldering property between the lead and the wire are lowered. Further, it is desirable to incorporate 0.01-0.30 wt.% P and if necessary, 0.01-3.0 wt.% one or more kinds of Fe, Ni and Sn in the copper base alloy. The productivity at the time of melting and casting, heat resistance, further the bonding property and the soldering property can be improved.
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