| 摘要 |
PROBLEM TO BE SOLVED: To obtain a paste having improved heat resistance, continuous printing performance and plate life elongation, low-temperature curability, low warpage and improved flexibility, adhesion, economical profitability, etc., by dispersing organic and/or inorganic microparticles in a modified polyamide imide resin having carbonate bonds. SOLUTION: A polyisocyanate is condensed with a derivative of a tribasic carboxylic acid having an acid anhydride group and a dicarboxylic acid compound of the formula (wherein R is a 1-12C alkylene; X is a 2-12C alkylene or phenylene; m is 1-50, and n is 1-20) by heating at 80-250 deg.C in a nitrogen-free polar solvent to obtain a modified polyamide imide resin having polycarbonate bonds and having a number-average molecular weight of 1,000-100,000. 1-80 wt.% organic and/or inorganic microparticles having a mean particle diameter of 10μm or below and a maximum particle diameter of 20μm or below are dispersed in a solution obtained by dissolving 5-40 wt.% above obtained modified polyamide imide resin with a polar solvent having a boiling point of 80-300 deg.C to obtain a paste having a viscosity of 100-10,000 P and a thixotropy factor of 1.5-10. |
