| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC card for holding an IC module in a card body in a stable state while maintaining adhesive properties of a cover sheet with the module. SOLUTION: In the IC card comprising an IC module having a resin molding part 4a incorporated with an IC chip 4d and contained in a penetrating part of a long rectangular card body 2 in an attitude sandwiched between cover sheets 3, a pressure sensitive adhesive sheet 5 made of thermosetting resin having small elastic modulus such as, for example, epoxy resin is interposed between the module and a laminating material 3. A resin molding part 4a of the module is formed of hard thermoplastic resin, while the body 2 and the material 3 are formed of flexible thermoplastic resin. Thus, even if deflecting amounts of the module and material 3 due to deformation of the body 2 are different, adhesive properties of both are maintained by the sheet 5. |
