发明名称 |
MANUFACTURE OF METAL-APPLIED LAMINATED PLATE, MANUFACTURE OF PRINTED WIRING BOARD, AND MANUFACTURE OF MULTILAYER PLATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal-applied laminated plate by which it is possible to mold a metal-applied laminated plate, taking advantage of the high adhesion properties of a joining material. SOLUTION: A joining material 5 is manufactured by forming a resin layer 2 comprising a thermocurable resin made up of a mixture of epoxy resin and melamine resin on both faces of a metal material 1. Further, a metal foil 4 is arranged on both faces of the joining material 5 respectively through a prepreg 3. Further, the metal-applied laminated plate A is molded by joining the metal foil 4 to both faces of the joining material 5 through thermal pressurizing process. |
申请公布号 |
JPH1110792(A) |
申请公布日期 |
1999.01.19 |
申请号 |
JP19970169256 |
申请日期 |
1997.06.25 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
HIGASHIDA TOSHIYUKI;MISAWA HIDETO |
分类号 |
B32B15/08;B32B27/04;B32B27/38;B32B27/42;H05K1/03;H05K3/46;(IPC1-7):B32B15/08 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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