发明名称 Method for fabricating capacitors of a dynamic random access memory
摘要 A method for fabricating capacitors of a DRAM by employing liquid-phase deposition. Since the working temperature required for performing liquid-phase deposition is low, the deposition process can be performed in the presence of the photoresist. This method comprises: filling the contact hole and covering the isolation layer with conductive layer; performing an etching process on the conductive layer by using photoresist and low-temperature spacer as mask; again performing an etching process on the conductive layer, to a desired depth by controlling the etching time and using the low-temperature spacer as mask; removing the low-temperature spacer for finally forming the lower electrode of a cylindrical capacitor.
申请公布号 US5861331(A) 申请公布日期 1999.01.19
申请号 US19980085490 申请日期 1998.05.27
申请人 UNITED MICROELECTRONICS CORP. 发明人 CHIEN, SUN-CHIEH
分类号 H01L21/02;H01L21/316;H01L21/3213;H01L21/8242;H01L27/108;(IPC1-7):H01L21/824 主分类号 H01L21/02
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