| 摘要 |
The invention relates to a coil element for a data carrier with an integrated circuit and noncontacting coupling and to a method for producing it. The coil element includes a carrier film or layer (6) and a wire-wound coil (2) fixed to the carrier layer (6). The carrier layer (6) serves to mechanically stabilize the wire-wound coil (2) and becomes part of the card body during production of the data carrier, for example an IC card. The coil (2) is fixed to the carrier film (6) during the winding process or directly following the winding process. The winding process and the apparatus used therefor are designed so that a plurality of coils (2) can be wound and fixed on a common carrier layer (6) simultaneously.
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