| 发明名称 |
CHIP SCALE PACKAGE WITH METAL WIRING SUBSTRATE |
| 摘要 |
<p>A chip-sized semiconductor package having a semiconductor chip formed with bonding pads; a circuit board provided with contact pads for electrically connecting the circuit board to external terminals, and circuit patterns for electrically connecting the circuit board to the chip; a tape bonding the circuit board to the chip; and wires electrically connecting the circuit board to the bonding pads on the chip; the package being encapsulated by a molding compound so that a part of a surface of the circuit board where the contact pads are formed is exposed.</p> |
| 申请公布号 |
KR0169820(B1) |
申请公布日期 |
1999.01.15 |
| 申请号 |
KR19950025959 |
申请日期 |
1995.08.22 |
| 申请人 |
SAMSUNG ELECTRONICS CO.,LTD. |
发明人 |
LEE, SANG-HYUK |
| 分类号 |
H01L23/34;H01L23/04;H01L23/12;H01L23/13;H01L23/31;H01L23/495;H01L23/498;(IPC1-7):H01L23/04 |
主分类号 |
H01L23/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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