| 发明名称 |
METHOD FOR IMPROVED ADHESION OF POLYMERIC ADHESIVE AND ENCAPSULATION MATERIAL |
| 摘要 |
<p>The invention provides a method of improving the adhesion between a polymeric adhesive (20, 22) and an encapsulating material (28) of the type used to encapsulate a semiconductor chip (14). The method involves the treatment of a polymeric adhesive so as to increase the number of bond sites to which the encapsulating material may adhere, thereby improving adhesion of the polymeric adhesive to the encapsulating material. The treatment may comprise oxidation, such as ozone oxidation, or high temperature baking, or plasma ashing, for example. <IMAGE></p> |
| 申请公布号 |
KR0167465(B1) |
申请公布日期 |
1999.01.15 |
| 申请号 |
KR19940002616 |
申请日期 |
1994.02.15 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ARCHAMBANLT, HELENE;BOUTIN, LYNDA;KAHN, STEVEN F. ROBERT;LAJZA JR., JOHN JAMES;LIUTKUS, JOHN JOSEPH;PARE, PATRICE;PETERSON, KIRK DAVID;SMITH, ROBERT MICHAEL;TREMBLAY, STEPHANE |
| 分类号 |
C08J5/12;C09J5/02;H01L21/56;H01L23/29;H01L23/31;H01L23/495;(IPC1-7):H01L23/28 |
主分类号 |
C08J5/12 |
| 代理机构 |
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