RESIN SEALING METHOD FOR SEMICONDUCTOR DEVICE

摘要

PURPOSE: To form a semiconductor device of high reliability by preventing voids from forming outside and inside a package and, further, preventing the generation of peeling and bulging through improvement of adhesion of lead frames and the like to a resin. CONSTITUTION: After a resin tablet 6c softens due to heat of a lower die 16c, a plunger 12c for pressurizing the tablet rises. After the tablet 6c is completely compressed and deformed and a resin is filled, evacuation is stopped.