The casing includes a bottom formed by ceramic-metal substrate, consisting of a ceramic layer whose both surfaces are metallised (8, 10) by metal foils. At least the first metal foil (8) is structured and forms an enclosed frame structure (8'), supporting a metal frame (4) open at both sides and surrounding the casing inside (3). It is soldered to the structure and hermetically closable by a lid (5). In the casing inside are formed free contact faces on the multiple substrate and/or conductor tracks (10') and/or fastening faces for semiconductor chips. All metal foils (8-10) and ceramic layers of the multiple substrate are interconnected by DCB technology, and all outer terminals are located on the multiple substrate.
