| 摘要 |
<p>A device for a circuit board (10) having one or more printed circuits with electronic components (14, 15). At least one of the components is a heat emitting power component (15) that is thermally connected to a plate (11) of thermally conductive material arranged as a sandwich or laminate construction at the circuit board. The thermally conductive plate (11) includes plateaus (16) extending toward the circuit board. The plateaus are covered by an electrically insulating and thermally conductive layer (13). The power component (15) is provided with a heat transferring surface (20) which abuts the plateau (16) or the thermally conductive layer (13).</p> |
