VERFAHREN ZUR LOKALEN HÄRTUNG EINES KLEBSTOFFES FÜR EINE INTEGRIERTE HALBLEITERSCHALTUNG

摘要

The local hardening method of a semiconductor integrated circuit is carried out through the steps of forming a hardening hole on a semiconductor integrated circuit at its attachment place with the PCB wafer for auto-inserting, detecting defects, reversing PCB to show an upper copper-clad side of the PCB, and coating a designated hole point of the reversed PCB with bond in a local bonding machine, so that the semiconductor integrated circuit can be mounted precisely on a designated point by coordinates in a semiconductor local mounting machine, by regulating soldering shapes by an auto-soldering machine after a semiconductor integrated circuit is attached, by passing ultraviolet rays through the hardening hold in an ultraviolet hardening machine and attaching and fixing a semiconductor integrated circuit on the copper-clad side of the PCB, so that the improvement of the productivity can be achieved by clearing up mounting twist, cooling solder, soldering short, and coming off phenomena of the attached semiconductor integrated circuit and making auto-mounting and auto-soldering of the semiconductor integrated circuit possible.