Klebeband verwendende Bindemaschine und Kleberband hierfür
摘要
The binding machine (1) using the tape employs the binding tape (6) having the bonding tape (7) coated on its rear surface with the adhesive and consists of the boring mechanism (2) for boring the aperture (h) through the papers (P) to be bound and the binding mechanism (3) which winds the bonding tape (7) around or halfway around the portion between the bored aperture (h) and the end surface (p1) of the papers (P) and so on to be bound and bonds the bonding tape (7) thereto. <IMAGE>
申请公布号
DE69412976(T2)
申请公布日期
1999.01.14
申请号
DE1994612976T
申请日期
1994.09.27
申请人
PICARD CO., TOKIO/TOKYO, JP
发明人
SAWADA, SUEJI, SUGINAMI-KU, TOKYO, JP;KASUYA, MASAYUKI, MINATO-KU, TOKYO, JP