Substrate-supported chip component production

摘要

A process for producing semiconductor components with chips mounted on a substrate employs a perforated substrate and involves applying an electrically insulating cover over the chips to form an insulated structure comprising the cover, the perforated substrate and the chips, this structure then being separated into individual single chip components of chip scale. Preferably, the cover is an injection moulded plastic encapsulation or a glass-sealed ceramic cap. Also claimed is a semiconductor component having a substrate (300) with a conductive pattern for connection to external leads, a solder mask for providing electrical connection between chip bond pads and the pattern and a cover, the novelty being that the substrate (300) has passage openings (301) for providing conductive paths from the pattern to the external leads and that the cover encloses the chip and the conductive paths while allowing free access to the external leads. Preferably, the substrate (300) is a ceramic substrate or a circuit board, consisting of bis-maleimide triazine or a high temperature epoxy resin.