摘要 |
<p>A semiconductor carrier for testing bumped semiconductor components, such as dice 41 packages (17A), having contact bumps (12C) are provided. The carrier includes a base (61), an interconnect (46), and a force applying mechanism. The interconnect includes patterns of contact members (64) formed as recesses covered with conductive layers. In addition to providing electrical connections, the contact members perform an alignment function by self centering the contact bumps within the contact members. The carrier can also include an alignment member (43) configured to align the components with the interconnect.</p> |
申请人 |
MICRON TECHNOLOGY, INC.;HEMBREE, DAVID, R.;FARNWORTH, WARREN, M.;WOOD, ALAN, G.;GOCHNOUR, DEREK;AKRAM, SALMAN |
发明人 |
HEMBREE, DAVID, R.;FARNWORTH, WARREN, M.;WOOD, ALAN, G.;GOCHNOUR, DEREK;AKRAM, SALMAN |