发明名称 ELECTRON FLOOD APPARATUS FOR NEUTRALISING CHARGE BUILD UP ON A SUBSTRATE DURING ION IMPLANTATION
摘要 An electron flood apparatus for neutralising positive charge build up on a substrate during ion implantation comprises a tube through which the ion beam passes to the substrate. Inert gas is supplied to the plasma chamber and a cathode in the plasma chamber is heated to emit electrons. An accelerating electrical supply is connected betweeen a cathode and an accelerating electrode in the plasma chamber to accelerate electrons emitted by the cathode to produce a plasma in the chamber. A separate cathode bias electrical supply is connected directly between the cathode and the substrate common terminal to set a desired bias potential on the cathode relative to the substrate independently of the acceleration potential.
申请公布号 WO9901885(A1) 申请公布日期 1999.01.14
申请号 WO1998GB01930 申请日期 1998.07.01
申请人 APPLIED MATERIALS, INC.;FOAD, MAJEED;MATSUNAGA, YASUHIKO 发明人 FOAD, MAJEED;MATSUNAGA, YASUHIKO
分类号 H01J37/02;H01J37/317 主分类号 H01J37/02
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