发明名称 |
Mini-module with upwardly directed leads and method for making |
摘要 |
A power module (10) with leads (16) extending upwardly. The circuit components (C) and connections (L) of the power module are arranged upon a substrate having interface leads (16) attached thereto extending away from the undersurface of the substrate (12). The interface leads extend through openings (14g) in a form-fitting molded case (14). The case has an open center region (14i) to facilitate performance of final assembly steps upon the module and is subsequently covered with a rugged lid (17) and is encapsulated with a suitable potting material (18). The interior of the module is filled with a gel to provide moisture-proof protection. <IMAGE> |
申请公布号 |
EP0890990(A2) |
申请公布日期 |
1999.01.13 |
申请号 |
EP19980111885 |
申请日期 |
1998.06.26 |
申请人 |
ILC DATA DEVICE CORPORATION |
发明人 |
MARRO, LEN |
分类号 |
H05K5/00;H01L25/16;H05K7/14 |
主分类号 |
H05K5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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