Low inductance power semiconductor module

摘要

The power module (1) includes several semiconductor power groups (2) and a cooling body (3). The power groups are located about both sides of the cooling body which has channels (7) supplied with cooling fluid. Both sides of the body also have substrates (8) of electrically insulating material with good thermal conducting properties, e.g. aluminium oxide. The semiconductor devices, e.g. thyristors, diodes etc. are surface mounted and the heat generated is dissipated into the fluid heat sink. The group mounting is made via a stack of low inductance conducting plates (4).